Wafter Megasonic single side Brushing & Cleaning Spin-Dryer


Classification:

Monolithic cleaning equipment

  • Product Description
  • Applicable parts:

    6"/8“Sapphire or SiC Wafer

    Capacity:

    60s/pcs

    Procedure Flow:

    Load→Location→Rotation,brushing,cleaning,two-fluid spraying(Si side)→Turn over 180 degree→Rotation,brushing,cleaning,megasonic spraying(C side)→Rotation,Spin-Drying→Unload
    Major Material: Metal Frame+PP white board
    Transportation: Wafer transported by clean robotic hand

    Process effect:

    a.particle size0.3~0.5um,remove %>90%or <200e.a;

    b.particle size0.5~1um,remove%>95%or <10e.a。

    PS:inspection machine is for Candela or SICA

     

Product inquiry