Product classification
- Product Description
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Applicable parts：
4”*2 pcs,6”*2 pcs,8”*1pc Wafer
Capacity： 1 batch/30min
Procedure flow： LOAD(Manual)→SPM槽→HQRD槽→HOF槽→UNLOAD(Manual) Major material： Metal frame SUS 304,PP board,the tank uses PPN/silicon Transportation： Manual Step time： Based on process,Adjustable Process effect： Removal organics on the surface of wafer Others： Customized:Semiautomatic or manual
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