8”/12" Wafer Deguming, Spliting & Cleaning Unit


Classification:

Tank cleaning equipment

  • Product Description
  •  Applicable parts: 8”/12”Wafer
     Capacity: 400~450 PCS/h
        Procedure  Flow: Load→QDR→Ultrasonic alkali Cleaning-→Deguming
    Tank→Spliting Tank→Inserting mechanism→Scan &
    Transportation mechanism→ (Ultrasonic alkali Tank
    1→Ultrasonic alkali Tank2→Rinsing Tank1→Rinsing Tank
    with slow lifting 2→Drying Tank 1→Drying Tank 2→Unload--Buffer)
        Major Material: Metal Frame,Tank use SUS316 mirror plate
        Transportation: Robotic arm Transporation
     Step Time: Based on process,adjustable
    Others: Customized:Semiautomatic or manual

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