8-12 Inches Silicon wafer Bushing Machine-Shengda Semiconductor Equipment (Jiangsu) Co., Ltd.

Product classification

Latest recommend

8-12 Inches Silicon wafer Bushing Machine

Classification:

Component cleaning equipment

Applicable parts：	8/12 Inches,φ200/300mm,thickness:0.5-1mm Wafer
Capacity：	Max:25pcs/min
Procedure flow：	LOAD(Manual)→Polyester Bushig both sides→PVC Bushing both sides→Insert to cassette→Ultrasonic Clean→UNLOAD(Manual)
Majormaterial：	Metal frame SUS 304,the tank uses PPN
Transportation：	Manual
Step time：	Based on process,Adjustable
Process effect：	Remove big particle on the surface of Wafer
Others：	Customized:Semiautomatic or manual

Address: 1001 Jingang Avenue, Zhangjiagang City, Jiangsu Province

Product inquiry